See more with X.Tract
X.Tract provides CT-quality inspection results of complex, multilayer electronics assemblies without slicing the board. In a rapid and user friendly process, it creates virtual microsections in any direction in the region-of-interest. X.Tract reveals defects that are obscured in 2D X-ray images of layered components.
The new X.Tract tool provides, fully automated acquisition, powerful image processing and detailed reporting. With X.Tract, users gain better insight into complex packages such as Package on Package (PoP) or dual-layered boards leading to reduced false call rates and higher productivity.
- Identify defects with ease from complex multi-layer boards
- Travel through a component by viewing 2D slices from any direction, enabling isolated clear views.
- Works for small and large boards and assemblies
- Automated, fast acquisition and view within minutes
- Available on XT V 160 systems